Example of ASIC developed: 2.5G PMU for Mobiles optimized for handset and handheld devices
Application examples:
- Digital Still Camera (DSC), CD players, PDAs,
Smartphones, Portable devices - Power management section details:
- Supply from 2 x Cells Alkaline /
NiMh, or 1 x rechargeable Li-Ion batteries - Battery Charger Interface
- Supply from 2 x Cells Alkaline /
7 X DC to DC Power Supplies:
- SW1: 1.2V to 1.8V – 100mV step and 2.5V / 300mA fully integrated STEP DOWN DC to DC Converter with low power mode for Core Processing Unit
- PWM1: 2.1V to 5.0V – 100mV step and 5.25V / 1200mA BOOST DC to DC Converter for IO processing Unit
- PWM2: 2.1V to 5.0V – 100mV step and 5.25V / 1200mA BOOST DC to DC Converter (Motor, Main supply, ..)
- PWM3: INVERTER Controller e.g. –7V / 30mA for Imager negative voltage generation
- PWM4: STEP UP Controller e.g. +15V / 30mA for Imager positive voltage generation
- PWM5: STEP UP Controller e.g. +15V / 30mA for LCD/Imager high voltage generation
- PWM6: STEP UP Controller e.g. +15V / 30mA for auxiliary voltages
5 X Voltage linear regulators:
- VSAVE LDO: 2V / 2mA regulator for internal supply (state machine, power on reset, oscillators)
- VBACKUP LDO: 2V to 3V (2.2V and 2.5V steps) / 500µA regulator for back-up battery or super Cap
- VRTC LDO: 1.8V / 50µA regulator for external low voltage RTC supply
- VANA LDO: 2.8V / 100mA low noise (< 25uVrms) high PSRR regulator for external analog
- LDO1: 1.8V to 5.0V – 100mV step and 5.25V / 1200mA Voltage regulator with external FET for DDR supply and DDR voltage reference
- LDO2: 1.8V to 5.0V – 100mV step and 5.25V / 1200mA Voltage regulator with external FET for system supply
- LDO3: 1.8V to 5.0V – 100mV step and 5.25V / 1200mA Voltage regulator with external FET for supply any kind of interface on board
Auxiliary cells:
- Voltage DAC reference
- Battery Charger for Li-Ion battery
- Power on Control
- Over-temperature detection (interrupt) and break (reset)
- Reset generator
- SPI / TWI interface
- Dynamic Power Management
- Very low quiescent current (<10uA in sleep mode, <100uA in standby mode)
- Minimum external components count
- Technology: CMOS 0.18 um High Voltage options (up to 35V)
- Die size: 14 mm2
- Package: BGA64 or QFN64